发明名称 |
Multilayer printed wiring board |
摘要 |
A multilayer printed wiring board has a core substrate, an interlayer insulation layer formed over the core substrate, conductive layers formed over the core substrate, and a via hole for providing electrical connection between the conductive layers. The conductive layers include a conductive layer formed on the core substrate, and the conductive layer formed on the core substrate has a side face in a form of rounded taper tapering toward the core substrate.
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申请公布号 |
US8110750(B2) |
申请公布日期 |
2012.02.07 |
申请号 |
US20090488299 |
申请日期 |
2009.06.19 |
申请人 |
INAGAKI YASUSHI;SANO KATSUYUKI;IBIDEN CO., LTD. |
发明人 |
INAGAKI YASUSHI;SANO KATSUYUKI |
分类号 |
H05K1/16;H01L21/48;H01L21/60;H01L23/498;H01L23/50;H01L23/538;H01L23/66;H05K1/02;H05K1/11;H05K1/18;H05K3/46 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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