发明名称 |
Method of making micromodules including integrated thin film inductors |
摘要 |
Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor. |
申请公布号 |
US8110474(B2) |
申请公布日期 |
2012.02.07 |
申请号 |
US20100906955 |
申请日期 |
2010.10.18 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
CAROBOLANTE FRANCESCO;HAWKS DOUGLAS ALAN |
分类号 |
H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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