发明名称 Method of making micromodules including integrated thin film inductors
摘要 Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor.
申请公布号 US8110474(B2) 申请公布日期 2012.02.07
申请号 US20100906955 申请日期 2010.10.18
申请人 FAIRCHILD SEMICONDUCTOR CORPORATION 发明人 CAROBOLANTE FRANCESCO;HAWKS DOUGLAS ALAN
分类号 H01L21/20 主分类号 H01L21/20
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