发明名称 |
Laser cutting method |
摘要 |
At least one exemplary embodiment is directed to a laser cutting method where a laser beam is condensed at internal points inside a substrate forming processing regions, and where the laser is swept along a cutting line, where the cutting line is associated with a recess on the substrate and where the recess can be formed contemporaneously with the formation of the processing regions. |
申请公布号 |
US8108998(B2) |
申请公布日期 |
2012.02.07 |
申请号 |
US20050273730 |
申请日期 |
2005.11.14 |
申请人 |
INADA GENJI;IRI JUNICHIRO;NISHIWAKI MASAYUKI;SUGAMA SADAYUKI;CANON KABUSHIKI KAISHA |
发明人 |
INADA GENJI;IRI JUNICHIRO;NISHIWAKI MASAYUKI;SUGAMA SADAYUKI |
分类号 |
H01L21/78;H01L21/30;H01L21/301 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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