发明名称 |
Temperature uniformity measurement during thermal processing |
摘要 |
Methods and systems for determining a radial differential metrology profile of a substrate heated in a process chamber is provided. Methods and systems for determining an angular or azimuthal differential metrology profile of a rotating substrate in a processing chamber are also provided. The radial and azimuthal differential metrology profiles are applied to adjust a reference metrology profile to provide a Virtual metrology of the process chamber. The virtual metrology is applied to control the performance of the process chamber. |
申请公布号 |
US8109669(B2) |
申请公布日期 |
2012.02.07 |
申请号 |
US20080273842 |
申请日期 |
2008.11.19 |
申请人 |
ADERHOLD WOLFGANG;RAVI JALLEPALLY;RAMACHANDRAN BALASUBRAMANIAN;HUNTER AARON M.;ILIOPOULOS ILIAS;APPLIED MATERIALS, INC. |
发明人 |
ADERHOLD WOLFGANG;RAVI JALLEPALLY;RAMACHANDRAN BALASUBRAMANIAN;HUNTER AARON M.;ILIOPOULOS ILIAS |
分类号 |
H01L21/66;H01L21/324 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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