Stack package, semiconductor package and method of manufacturing the stack package

摘要

PURPOSE: A stack package, a semiconductor package and a method of manufacturing the stack package are provided to improve the heat dissipation property of a stack package by using a support member as a heat discharging path. CONSTITUTION: A first semiconductor chip(100) comprises a semiconductor layer(110), a wiring layer(120), a connection bump(130), and a penetrating electrode(140). A second semiconductor chip(200) is laminated in the top side of the first semiconductor chip. The second semiconductor chip comprises a semiconductor layer(210), a wiring layer(220), and a micro connection bump(230). A supporting member(310) is attached to the top side of the first semiconductor chip through an adhesive layer. A molding member(330) covers the first semiconductor chip to cover the second semiconductor chip and the supporting member.