发明名称 SUBSTRATE MOUNTING STAGE, METHOD FOR FORMING RESIN PROTRUDENT LAYER TO SURFACE OF SUBSTRATE MOUNTING STAGE, AND RESIN PROTRUDENT LAYER TRANSFERING MEMBER
摘要 PURPOSE: A substrate mounting stage, a method for forming a resin protruded layer to surface of a substrate mounting stage, and a resin protruded layer transferring member are provided to improve thermal transfer efficiency by sealing a thermal transfer gas transmitted to a substrate mounting side. CONSTITUTION: A substrate mounting table(12) is arranged around a substrate mounting side(13a). The substrate mounting table is composed of a material(13) and an electrostatic chuck(54) which is arranged in the top side of the convex part of the material(13). The electrostatic chuck is comprised of an alumina layer(52) and an electrostatic electrode plate(16) which is built in the alumina layer. A stepped part(56) is arranged around the top side of the alumina layer as same height as a resin protrusion layer which is formed in the top side of the substrate. A second adhesive layer(44) coated in the resin protrusion layer in the substrate mounting region.
申请公布号 KR20120010569(A) 申请公布日期 2012.02.03
申请号 KR20110072236 申请日期 2011.07.21
申请人 TOKYO ELECTRON LIMITED 发明人 MINAMI MASATO;SASAKI YOSHIHIKO
分类号 H01L21/683;C23C16/458;G02F1/13;H01L21/205 主分类号 H01L21/683
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