| 摘要 |
<p>PURPOSE: A stack package and a method for manufacturing thereof are provided to reduce manufacturing cost without a printed circuit board by inputting semiconductor chips an adhesive member. CONSTITUTION: A cover film(120) has one-side(120a) and the other side(120b) facing to the one side. A first package(140) comprises a first semiconductor chip(130), a first adhesive member(136,) and a first circuit pattern(138). The first semiconductor chip comprises a first semiconductor chip body(131), a first bonding pad(132), and a first bump(134). A second package(160) comprises a second semiconductor chip(150), a second adhesive member(156), and a second circuit pattern(158). The second semiconductor chip comprises a second semiconductor chip body(151), a second bonding pad(152), and a second bump(154).</p> |
