LED CHIP SURFACE MOUNTED PACKAGING STRUCTURE BASED ON SILICON SUBSTRATE AND PACKAGING METHOD THEREOF

摘要

A surface mounted packaging structure of light emitting diode (LED) chip based on a silicon substrate and its packaging method thereof. Said structure includes a silicon substrate (1), a LED chip (2), a circular convex wall (11) and a lens (12). The upper surface of said silicon substrate (1) is plane structure. An oxide layer (5) covers the upper surface of said silicon substrate (1), a metal electrode layer (4) covers the upper surface of said oxide layer (5), and metal bumps (3) are set on the upper surface of said metal electrode layer (4). Through holes (6) are set to penetrate said silicon substrate (1) under said metal electrode layer (4). An insulation layer (7) covers the interior wall of said through holes (6) and parts of the undersurface of said silicon substrate (1). A metal connection layer (8) covers the surface of said insulation layer (7) which is inside the through holes (6). Two conductive metal welding pads (9) are set on the undersurface of said silicon substrate (1) respectively and are insulated with said silicon substrate (1). A heat-conducting metal welding pad (10) is set on the undersurface of said silicon substrate (1). Said LED chip (2) is flipped on said silicon substrate (1). Said LED chip (2) and said metal electrode layer (4) are isolated from outside by said circular convex wall (11) and said lens (12).