| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to arrange a cross sectional surface of a pattern into a curved shape, thereby preventing resistance concentration in an edge. CONSTITUTION: An insulating plate(110) is comprised of a polymer substrate with thermosetting or thermoplastic property, a ceramic substrate, an organic-inorganic composite material substrate, or a glass fiber impregnation substrate. A plurality of first circuit patterns(120) is formed into a base circuit pattern on the insulating plate. The first circuit pattern is made of materials with high conductivity and low resistance. The first circuit pattern and the insulating plate are formed with existing CCL(Copper Clad Laminate) materials. An insulating layer(130) is formed by burying the first circuit pattern on the insulating plate. The insulating layer is arranged into a plurality of insulating layers. A metal layer(140) is made of copper, nickel, or an alloy of copper and nickel. A second circuit pattern(150) is formed into a curved shape without an edge. |
