Diamond Metal Bonded Back Grinding Tip for Rough Grinding of brittle and high hardness materials of large scale and Grinding Wheel having the Grinding Tip

摘要

PURPOSE: A metal bond grinding tip for a large-diameter, high-hardness, and high-brittleness wafer and a grinding wheel having the same are provided to grind a workpiece without contact with a metal bond layer. CONSTITUTION: A metal bond grinding tip for a large-diameter, high-hardness, and high-brittleness wafer comprises a metal bond layer, abrasive grains, and filler. The filler is glass particles having 450~550Kg/mm^2 Knoop hardness. The hardness of the metal bond layer is HRB(Rockwell Hardness) 80-95, and the transverse rupture strength is 5-20 kg/mm.