| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost Sn plated material that is formed with a Cu-Sn alloy layer as an intermediate layer between a Ni layer formed as a base layer on a surface of a material and a Sn layer formed as the outermost layer, is formed with a base layer exposing part with high accuracy, and is less likely to cause peeling between the base layer and the intermediate layer, and a method for manufacturing the Sn plated material.SOLUTION: After a Ni plated layer 12' is formed on the substantially whole surface of a substrate 10 made of copper or a copper alloy by electroplating, a tape is stuck on a part of the surface of the Ni plated layer 12' and cathode electrolytic degreasing is performed as pretreatment of Cu plating. Subsequently, a Cu plated layer 14' and a Sn plated layer 16' are formed in this order by electroplating, and then the tape is peeled off to perform heat treatment.SELECTED DRAWING: Figure 2E |
