| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable composition quickly curable and capable of increasing adhesive force of the cured product to a connection object member, and to provide a connection structure produced by using the curable composition. <P>SOLUTION: The curable composition includes a curable compound having a thiirane group, a thermosetting agent and a phenoxy resin having a weight-average molecular weight of ≥5,000. The connection structure 1 is provided with a first connection object member 2, a second connection object member 4 and a connection part 3 connecting the first and second connection object members 2, 4. The connection part 3 is made of the curable composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
