发明名称 表面処理方法、及び、表面処理装置
摘要 PROBLEM TO BE SOLVED: To suppress thermal damage to an object to be treated, and to more rapidly perform surface treatment by thermal plasma.SOLUTION: A surface treatment method for performing surface treatment of a sample with thermal plasma, includes a first application step S202 of applying a first magnetic field to the thermal plasma by passing an AC current having a first amplitude through a coil, and a second application step S203 of applying a second magnetic field to the thermal plasma by passing an AC current having a second amplitude different from the first amplitude through the coil. The first application step S202 and the second application step S203 are repeated in such a way that the surface temperature of the sample arranged in the thermal plasma is maintained within the predetermined range, and the intensity of the first wavelength component included in an emission spectrum of the thermal plasma is different by the predetermined value or more between the first application step S202 and the second application step S203.
申请公布号 JP5984110(B2) 申请公布日期 2016.09.06
申请号 JP20120061001 申请日期 2012.03.16
申请人 国立大学法人金沢大学 发明人 田中 康規;藤本 健太;春多 洋佑
分类号 C23C26/00;C23C8/36 主分类号 C23C26/00
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