发明名称 MEMSデバイス
摘要 According to one embodiment, a MEMS device is disclosed. The device includes a substrate, a first and second MEMS elements on the substrate. Each of the first and second MEMS elements includes a fixed electrode on the substrate, a movable electrode above the fixed electrode, a first insulating film, the first insulating film and the substrate defining a cavity in which the fixed and movable electrodes are contained, and a first anchor on a surface of the first insulating film inside the cavity and configured to connect the movable electrode to the first insulating film. The cavity of the first MEMS element is closed. The cavity of the second MEMS element is opened by a through hole.
申请公布号 JP5985451(B2) 申请公布日期 2016.09.06
申请号 JP20130185606 申请日期 2013.09.06
申请人 株式会社東芝 发明人 中村 直文;増西 桂;林 裕美;浅野 佑策;池橋 民雄;出口 淳;小野 大騎
分类号 G01L9/00;B81B3/00;H01L29/84 主分类号 G01L9/00
代理机构 代理人
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