| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and the like of less consumption amount of a high-temperature/high-pressure fluid utilized for dehydration of a processing target substrate. <P>SOLUTION: In a first material container part 41, a heating mechanism 42 renders a liquid material to be a high-temperature/high-pressure fluid. The high-temperature/high-pressure fluid is supplied to a processing chamber 31 by opening of a supply valve 412 in a material supply channel 411, and dehydration of a processing target substrate W by using the high-temperature/high-pressure fluid is performed. A second material container part 41 is cooled to a condensation temperature of the material or lower by second cooling mechanisms 43a, 43b thereby causing a recovery valve 412 to open, and the high-temperature/high-pressure fluid in the processing chamber 31 is recovered to the second material container part 41. The recovered material is reused as a material to be supplied from the first material container part 41 to the processing chamber 31. <P>COPYRIGHT: (C)2012,JPO&INPIT |
