MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

The present invention relates to a manufacturing method of a semiconductor device. A technical problem to be solved is to provide a manufacturing method of a semiconductor device which mutually connects a semiconductor die to a substrate by laser irradiation to improve electrical connection reliability of the semiconductor die and the substrate, which uses a non-conductive paste including volatile flux to connect a conductive bump to the substrate without separate pressure, and which can electrically insulate each conductive bump without separate underfill injection to improve productivity per time.