The present invention relates to an electrode assembly having a laminate structure comprising: a first insulating capping layer; a first conducting layer capped by the first insulating capping layer and substantially sandwiched by at least the first insulating capping layer such as to leave exposed only an electrical contact lip of the first conducting layer; and an array of etched voids extending through at least the first insulating capping layer and the first conducting layer, wherein each void is partly bound by a surface of the first conducting layer which acts as an internal submicron electrode.
申请公布号
US2012024571(A1)
申请公布日期
2012.02.02
申请号
US200913130878
申请日期
2009.11.30
申请人
FREEMAN NEVILLE JOHN;MOUNT ANDREW RAYMOND;WALTON ANTHONY JOHN;TERRY JONATHAN GORDON;THE UNIVERSITY COURT OF THE THE UNIVERSITY OF EDINBURGH;NANOFLEX LIMITED
发明人
FREEMAN NEVILLE JOHN;MOUNT ANDREW RAYMOND;WALTON ANTHONY JOHN;TERRY JONATHAN GORDON