发明名称 SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To resolve a problem that, although there is a need to press a circumference region of an island or a hanging pin provided around the island by a clamper of a bonding device for preventing the floating of the island when ultrasonic wave bonding of a metal ribbon is performed, the island side can not be pressed in the case that a sufficient circumference region of the island can not be ensured or in the case that the hanging pin can not be provided by miniaturization of the device. <P>SOLUTION: A plurality of projections that project on a lead side so as to have the same height as that of a lead end part, are provided to a side opposite to a lead of the island. The projections and the lead end part are pressed simultaneously by a clamper. Thereby, floating of the island can be prevented even when neither hanging pin nor pressing region around the island is provided. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012023204(A) 申请公布日期 2012.02.02
申请号 JP20100159909 申请日期 2010.07.14
申请人 ON SEMICONDUCTOR TRADING LTD 发明人 URUSHIBATA HIROYOSHI
分类号 H01L23/50;H01L21/60 主分类号 H01L23/50
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