| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipation substrate which is excellent in heat dissipation and deals with the output and capacity increase and the integration enhancement of electronic components, which are associated with the increase in the heat value. <P>SOLUTION: A heat dissipation substrate 100 in which electronic components are mounted includes an insulation substrate 1 in which at least one through hole 2 is provided, a metal piece 3 mounted in the through hole 2 and has thickness corresponding to the thickness of the insulation substrate 1, rand 4 provided on a front surface of the insulation substrate 1 and formed so as to cover an end surface of the metal piece 3 on the front surface side, which is exposed from the through hole 2, and a periphery of the through hole 2 on the front surface side, and a ceramic layer 8 provided on a back surface of the insulation substrate 1 and formed so as to cover an end surface of the metal piece 3 on the back surface side, which is exposed from the through hole 2, and a periphery of the through hole 2 on the back surface side. <P>COPYRIGHT: (C)2012,JPO&INPIT |
