| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module and a method of manufacturing the semiconductor module capable of suppressing increase of manufacturing processes and increase in a material cost. <P>SOLUTION: A method of manufacturing a semiconductor module includes: a step of preparing a metal plate having first and second electrode planes 110 and 120 arranged on both sides of a slit on the same plane level, and in which the first electrode plane 110 and the second electrode plane 120 are coupled partially by a coupling region bridged above a slit; a step of electrically connecting a first main electrode 21 to the first electrode plane 110 and connecting a second main electrode 22 to the second electrode plane 120 by a solder reflow in order to mount a semiconductor device 20 having the first and second main electrodes 21 and 22 on the metal plate; and a step of cutting the coupling region to separate the first electrode plane 110 and the second electrode plane 120 from each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
