| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small size package for containing a piezoelectric element in which such a situation as the area of connection pads is decreased and a piezoelectric element cannot be mounted at a desired position is eliminated, and bonding force of a conductive adhesive is high, and to provide a method of manufacturing the same. <P>SOLUTION: The package for containing a piezoelectric element comprises an insulating substrate 1, a frame 2 consisting of a sintered body of insulating paste standing on the peripheral part of the insulating substrate 1, a pair of connection pads 31, 32 provided on the top face of the insulating substrate 1 in contact with the frame 2 at least partially, and conductor walls 41, 42 standing along the inside wall of the frame 2 in the regions of the pair of connection pads 31, 32 where the connection pads are in contact with the frame 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
