发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To improve efficiency in use of a first gas. <P>SOLUTION: A manufacturing method of a semiconductor device has steps of supplying a first gas into a processing chamber from a first nozzle communicating with the processing chamber while decreasing exhaust velocity in the processing chamber, supplying an inert gas into the first nozzle after stopping the supply of the first gas, and removing the first gas remaining in the processing chamber. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012023221(A) 申请公布日期 2012.02.02
申请号 JP20100160265 申请日期 2010.07.15
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 ASAI MASAYUKI;OKAMIYA HIROKI;KUMON SATAO;NAKAISO NAOHARU;MIZUNO KANEKAZU
分类号 H01L21/318;C23C16/455;H01L21/31 主分类号 H01L21/318
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