发明名称 |
METHOD FOR CUTTING POLARIZING PLATE AND POLARIZING PLATE CUT BY SAID METHOD |
摘要 |
<p>Disclosed is a method that, in the cutting of a polarizing plate using laser light, cuts a polarizing plate, which contains a layer that is a film having an average rate of absorption of laser light in the emission wavelength range of the radiated laser light of no more than 2%, without causing deformation of the cut surface. The method cuts a polarizing plate, which contains a layer that is a film having an average rate of absorption of laser light in the emission wavelength range of the radiated laser light of no more than 2%, and said method contains: a groove-forming step that forms a groove in the abovementioned film by means of radiating laser light having a regulated output and/or rate of traversing; and a tearing step that tears the abovementioned polarizing plate along the abovementioned groove after the abovementioned groove-forming step while regulating the tearing angle and the tension applied to the polarizing plate.</p> |
申请公布号 |
WO2012014639(A1) |
申请公布日期 |
2012.02.02 |
申请号 |
WO2011JP65369 |
申请日期 |
2011.07.05 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED;OIKAWA, SHIN;MATSUMOTO, RIKIYA |
发明人 |
OIKAWA, SHIN;MATSUMOTO, RIKIYA |
分类号 |
B23K26/38;B23K26/00;B23K26/40 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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