| 发明名称 |
CURABLE RESIN COMPOSITION |
| 摘要 |
<p>A curable resin composition which exhibits high initial adhesion and bond durability is provided. The curable resin composition comprises (A) an oligomer which is free from epoxy groups and has a diene-based skeleton or a hydrogenated diene-based skeleton, (B) a (meth)acrylate which can form a homopolymer having a glass transition temperature of -100 to 60°C, (C) a radical polymerization initiator, and (D) a reducing agent. The curable resin composition is usable as an adhesive composition for use in laminated touch panels.</p> |
| 申请公布号 |
WO2012014682(A1) |
申请公布日期 |
2012.02.02 |
| 申请号 |
WO2011JP65999 |
申请日期 |
2011.07.13 |
| 申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA;HISHA, YUKI;WATANABE, JUN;YODA, KIMIHIKO |
发明人 |
HISHA, YUKI;WATANABE, JUN;YODA, KIMIHIKO |
| 分类号 |
C08F290/04;C09J4/02;C09J11/06;C09J109/00;G02F1/1333 |
主分类号 |
C08F290/04 |
| 代理机构 |
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