发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package substrate with high reliability that can effectively perform bumping and remove resist on forming a metal post by bumping, without damaging to the metal post while achieving an economical and efficient process. <P>SOLUTION: The method comprises a step of preparing a base substrate 101 having a connection pad 102 exposed by a solder resist open part; a step of forming a foam resin layer 107 having an opening for forming a metal post on a solder resist 103; a step of forming a metal post 108 on the opening; and a step of removing the foam resin layer 107. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012023364(A) |
申请公布日期 |
2012.02.02 |
申请号 |
JP20110139214 |
申请日期 |
2011.06.23 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KIM JON-WON;CHOI JING WENG;PARK JUN-HYUN |
分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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