发明名称 GROOVING METHOD FOR LAMINATED SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To maintain a favorable insulation property and to suppress the occurrence of defect at the edge part of a groove when forming the groove on a metallic film in the laminated substrate of a thin-film solar cell or the like. <P>SOLUTION: A grooving method for laminated substrates is used for forming grooves by removing a part of a metallic thin film formed on a laminated substrate, and includes a laser beam irradiation step and a laser beam scanning step. In the laser beam irradiation step, a rectangular laser beam is irradiated on the groove-planned line of the metallic thin film. In the laser beam scanning step, the laser beam is scanned along the groove-planned line so that a beam overlapping rate is in the range of >60% but &le;85%. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012020303(A) 申请公布日期 2012.02.02
申请号 JP20100158748 申请日期 2010.07.13
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 MURAKAMI MASANAO;HATA TSUYOSHI
分类号 B23K26/073;B23K26/00;B23K26/36;H01L31/04 主分类号 B23K26/073
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