发明名称 |
MODULE AND PRODUCTION METHOD |
摘要 |
The invention specifies a module comprising a carrier substrate (6) having an electrical wiring and a component chip mounted on the carrier substrate (6) using flip-chip technology, wherein the component chip (1) has, on its surface (2) facing the carrier substrate (6), component structures (3), a supporting frame (4) and supporting elements (5), the supporting elements (5) produce an electrical connection between the component structures (3) and the electrical wiring of the carrier substrate (6), and the height of the supporting elements and the height of the supporting frame (4) correspond. Furthermore, the invention specifies a method for producing the module. |
申请公布号 |
WO2012013416(A1) |
申请公布日期 |
2012.02.02 |
申请号 |
WO2011EP59961 |
申请日期 |
2011.06.15 |
申请人 |
EPCOS AG;LEE, KIM CHOONG;HUESGEN, MARC |
发明人 |
LEE, KIM CHOONG;HUESGEN, MARC |
分类号 |
H01L21/56;B81B7/00;H01L21/60;H01L23/31;H03H9/10 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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