A semiconductor device comprises a lead frame (101), a semiconductor element (103) which is supported on the lead frame (101), a frame body (105) which is formed on the lead frame (101) so as to surround the semiconductor element (103), cover a side surface of the lead frame (101) and expose the bottom surface of the lead frame (101), and a protective resin (107) which is filled in an inner area of the frame body (105). The lead frame (101) has multiple protruded parts or recessed parts formed on a part that is covered by the frame body (105) on the upper surface of the lead frame (101).
