发明名称 Wafer cutting tool
摘要 The inventive concept is directed to a circular cutting device, especially designed or used in cutting circular wafer in an ostomy application. The device consists of a handle having at one end thereof a circular backup plate. On top of the backup plate is located a plastic cutting receiving plate. The circular backup plate has at its center a threaded rod to receive a circular cup thereon. The cup has at its lower circular edge a razor-like cutting edge which will cut a perfect wafer when screwed down onto the plastic cutting receiving plate by way of the threaded rod.
申请公布号 US2012023757(A1) 申请公布日期 2012.02.02
申请号 US20100804913 申请日期 2010.08.02
申请人 发明人 SCHENA KENNETH R.
分类号 B26B25/00 主分类号 B26B25/00
代理机构 代理人
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