发明名称 WIRING SUBSTRATE WITH BUILT-IN FUNCTION ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring substrate with a built-in function element in which local concentration of stress is relaxed and generation of stress can be reduced when a function element is built in an opening provided in a reinforcement layer. <P>SOLUTION: The wiring substrate with a built-in function element comprises a function element having an electrode terminal; a reinforcement layer in which a function element is arranged and having an opening where a part facing a corner of the function element is curved; a filling resin arranged between the function element arranged in the opening and the reinforcement layer; a stress relax via formed in the filling resin; and a first wiring layer electrically connected with the electrode terminal on the surface side of the function element where the electrode terminal is arranged. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012023237(A) 申请公布日期 2012.02.02
申请号 JP20100160597 申请日期 2010.07.15
申请人 NEC CORP 发明人 NAKAJIMA YOSHIKI;YAMAMICHI SHINTARO;KIKUCHI KATSU;MORI KENTARO;MURAI HIDEYA;OSHIMA DAISUKE
分类号 H05K3/46 主分类号 H05K3/46
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