发明名称 METHOD AND APPARATUS FOR JOINING SOLAR CELL MODULE
摘要 <P>PROBLEM TO BE SOLVED: To suppress warpage of solar cells. <P>SOLUTION: A connection method of a solar cell module includes: a) a first pressing process in which an interconnector made of a metal body coated by a solder layer is brought into contact with an electrode of a solar cell; b) a second pressing process in which the interconnector is locally brought into contact with the electrode of the solar cell with two or more heater chips which are placed apart from each other; and c) a joining process in which the heater chips produce heat for a short time to melt the solder layer with the heat so that the interconnector is soldered to the electrode of the solar cell. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012023069(A) 申请公布日期 2012.02.02
申请号 JP20100157484 申请日期 2010.07.12
申请人 NIPPON AVIONICS CO LTD 发明人 SEKIMOTO TAKASHI
分类号 H01L31/042 主分类号 H01L31/042
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