| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component structure and an electronic device which allow an electrode part to be well soldered to a substrate. <P>SOLUTION: An electronic component structure and an electronic device of the embodiment comprise an electronic component, an electrode part and a restricting part. The electrode part is connected to the electronic component in a stacking manner and has a plurality of soldering regions on the side opposite to the electronic component side. The soldering regions are each soldered to a substrate via respective soldered portions. The restricting part is arranged to be connected to a peripheral portion of the soldering region, and is formed to have a step relative to the soldering region. <P>COPYRIGHT: (C)2012,JPO&INPIT |
