| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip type laminated ceramic capacitor capable of improving a mounting efficiency when leg-shaped external terminals are attached thereto, and suppressing vibration sound of a circuit board when mounted on the board. <P>SOLUTION: A method for manufacturing a chip type laminated ceramic capacitor is provided. In the method, when leg-shaped external terminals 14a and 14b are attached to external electrodes 12a and 12b at both ends of the chip type laminated ceramic capacitor 10, first metal plating layers 13a and 13b having a melting point of 400°C or more are formed on external electrodes, respectively, and the external terminals, each having a nealy U-shaped front shape in which the center of an upper end is cut away, and having a L-shaped side surface formed by bending its lower end at a nealy right angle, are fixed to the external electrodes with spot welding via the first metal plating layers, respectively, and second metal plating layers 16a and 16b are formed on the lower ends 15d of the external terminals, respectively. Accordingly, when the external terminals are soldered on lands of a circuit board, this improves solder wettability and prevents the external terminals from removing due to heating at the time of soldering. <P>COPYRIGHT: (C)2012,JPO&INPIT |
