| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device which reduces the erroneous mounting of a semiconductor device to a socket and reduces the number of times of mounting to the socket. <P>SOLUTION: The electronic device comprises a plurality of semiconductor devices 10; a wiring board 2; and a cover member 3: the plurality of semiconductor devices have semiconductor chips; resin sealing bodies for sealing semiconductor chips; and a plurality of first terminals for external connection electrically connected semiconductor chips, respectively: the wiring board has a main surface; a plurality of electrode pads formed on the main surface; a rear surface opposed to the main surface; and a plurality of second terminals for external connection formed on the rear surface: the plurality of semiconductor devices are mounted to the main surface so that the plurality of first terminals for external connection of the plurality of semiconductor devices are electrically connected to the plurality of electrode pads, respectively: the cover member is formed on the main surface of the wiring board so as to seal the plurality of semiconductor devices, and the plurality of first terminals for external connection project from side surfaces of resin sealing bodies. <P>COPYRIGHT: (C)2012,JPO&INPIT |
