| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit connecting adhesive film which can suppress the deformation of a glass board while keeping excellent connection reliability even if used for connection between the glass board thinner in thickness than a conventional circuit board and a semiconductor element, and is excellent in film-forming property. <P>SOLUTION: This circuit connecting adhesive film 10 has an insulating adhesive layer 3a which has a conductive adhesive layer 3b containing an adhesive composition 4b and a conductive particle 5, and an insulating adhesive layer 3a containing the adhesive composition 4a but not containing the conductive particle. The adhesive composition 4a contained in the insulating adhesive layer 3a contains a film-forming material, an epoxy resin, a latent curing agent and an organic particle. The organic particle is constituted of at least one selected from a group composed of a (meth)acrylic acid alkyl ester-butadiene-styrene copolymer or a composite, a (meth)acrylic acid alkyl ester-silicone copolymer or a composite, and a silicone-(meth)acrylic acid copolymer or a composite. <P>COPYRIGHT: (C)2012,JPO&INPIT |
