发明名称
摘要 <p>According to one non-limiting embodiment, a low conductive emission substrate includes a plurality of thin high dielectric strength insulating layers separated by a corresponding plurality of conductive layers, wherein one of the plurality of conductive layers is shorted to another one of the plurality of conductive layers.</p>
申请公布号 JP2012503333(A) 申请公布日期 2012.02.02
申请号 JP20110527857 申请日期 2009.08.13
申请人 发明人
分类号 H01L23/12;H05K1/02;H05K3/46 主分类号 H01L23/12
代理机构 代理人
主权项
地址