| 摘要 |
An electronic device is disclosed. One embodiment provides a metallic body. A first electrically insulating layer is applied over the metallic body and having a thickness of less than 100 μm. A first thermally conductive layer is applied over the first electrically insulating layer and having a thermal conductivity of more than 50 W/(m·K). A second electrically insulating layer is applied over the first thermally conductive layer and having a thickness of less than 100 μm.
|
