| 摘要 |
<P>PROBLEM TO BE SOLVED: To apply an external force onto a sapphire wafer having protective tape adhered on its surface and modified layers formed therein to divide the sapphire wafer into each device, with improved quality. <P>SOLUTION: A division method includes a step to adhere ultraviolet curing protective tape T1 on a surface W1 of a sapphire wafer W; a step to form modified layers 100 inside the sapphire wafer W by condensing a pulsed laser; a step to irradiate the ultraviolet curing protective tape T1 with UV rays to cure a glue layer 2; and a step to divide the sapphire wafer W into each light-emitting device D along a division plan line L by applying an external force onto the sapphire wafer W along the division plan line L via the ultraviolet curing protective tape T1. At the point when applying the external force onto the sapphire wafer W via the ultraviolet curing protective tape T1, since the glue layer 2 of the ultraviolet curing protective tape T1 is cured, the applied external force is not dispersed in the ultraviolet curing protective tape T1, and thereby, the sapphire wafer W can be divided into the light-emitting device D by breaking the sapphire wafer W from a side where the ultraviolet curing protective tape T1 is adhered with favorable quality. <P>COPYRIGHT: (C)2012,JPO&INPIT |
