| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin seal type semiconductor device formation method which can encapsulate a semiconductor device with a resin while preventing occurrence of cracks reaching the semiconductor device. <P>SOLUTION: In a space between a semiconductor device 10 and presser foot pins 43, a first resin material 44 having quality same as that of an encapsulation resin is used at portions contacting the semiconductor device 10, and a second resin material 45 of a melting point higher than that of the encapsulation resin is used at portions contacting the presser foot pins 43. In this state, the semiconductor device 10 is pressed by the presser foot pins 43. The encapsulation resin is infused into a cavity 50 to encapsulate the semiconductor device 10 with the first resin material 44 being integrated with the encapsulation resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
