发明名称 |
METHOD OF PREPARING A HEAT-RESISTANT POLYAMIDE |
摘要 |
The present invention relates to a method of prepairing a heat-resistant polyamide by carrying out condensation polymerisation with a monomer mixture including a diester compound and a diamine compound. The present invention provides an economical method of prepairing a heat-resistant polyamide in that a monomer, a raw material, is simply and chiefly prepared, and the polymerizing reaction time is short because it does not need solvent separately.
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申请公布号 |
US2012029163(A1) |
申请公布日期 |
2012.02.02 |
申请号 |
US200913263620 |
申请日期 |
2009.04.10 |
申请人 |
HWANG DONG-JUNE;LIM JAE-BONG;LEEM SEUNG-DO;KIM TAE-YOUNG;BAE SUNG-SU;SK CHEMICALS CO., LTD. |
发明人 |
HWANG DONG-JUNE;LIM JAE-BONG;LEEM SEUNG-DO;KIM TAE-YOUNG;BAE SUNG-SU |
分类号 |
C08G69/30;C08G69/26 |
主分类号 |
C08G69/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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