METHOD OF PREPARING A HEAT-RESISTANT POLYAMIDE

摘要

The present invention relates to a method of prepairing a heat-resistant polyamide by carrying out condensation polymerisation with a monomer mixture including a diester compound and a diamine compound. The present invention provides an economical method of prepairing a heat-resistant polyamide in that a monomer, a raw material, is simply and chiefly prepared, and the polymerizing reaction time is short because it does not need solvent separately.