Bump for semiconductor chip and method for manufacturing the same

摘要

PURPOSE: A bump of a semiconductor chip and a manufacturing method thereof are provided to reduce manufacturing processes by integrating a bump for an external terminal with a buffer bump formed on a bonding pad. CONSTITUTION: A buffer bump(22) is formed on a bonding pad(16) of a semiconductor chip. A bump for an external terminal is integrated with the upper side of the buffer bump and is upwardly protruded. A conductive solder(28) is plated on the upper side of the bump for the external terminal. External force applied through the bump for the external terminal is directly buffered in the buffer bump and is distributed to a passivation layer in a lateral direction of the buffer bump.