PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING SAME, METHOD FOR FORMING RESIST PATTERN, METHOD FOR PRODUCING LEAD FRAME, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

Disclosed is a photosensitive resin composition which is configured to contain: a binder polymer that has a constituent unit derived from a (meth)acrylic acid and a constituent unit derived from a benzyl (meth)acrylate or a benzyl (meth)acrylate derivative; a polymerizable compound that has at least one ethylenically unsaturated bond; and a photopolymerization initiator that contains an acylphosphine oxide compound and a hexaaryl biimidazole derivative.