| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent chips or cracks in substrates in the substrate grinding and polishing processes and facilitate dice cutting in the manufacturing process of a semiconductor element. <P>SOLUTION: The manufacturing method of the semiconductor element includes an adhesion process in which a surface 10A of a substrate 10, having a semiconductor layer on the surface, is bonded to a polishing support member 50 with an adhesive 40 through a plate-like adhesion member 20A, a hardening process in which the adhesive 40 is hardened, and a polishing process in which a back surface 10B of the substrate 10, which is bonded to the polishing support member 50 through the adhesion member 20A, is polished to a predetermined thickness. <P>COPYRIGHT: (C)2012,JPO&INPIT |
