发明名称 Power Semiconductor Module, Method for Producing a Power Semiconductor Module and a Housing Element for a Power Semiconductor Module
摘要 A power semiconductor module includes a housing element into which one or more connecting lugs are inserted. Each connecting lug has a foot region on the topside of which one or more bonding connections can be produced. In order to fix the foot regions, press-on elements are provided, which press against the end of the connecting lug.
申请公布号 US2012025393(A1) 申请公布日期 2012.02.02
申请号 US201113192323 申请日期 2011.07.27
申请人 KIRSCH OLAF;KANSCHAT PETER;ROEHRIG ANDRE;STOLZE THILO;INFINEON TECHNOLOGIES AG 发明人 KIRSCH OLAF;KANSCHAT PETER;ROEHRIG ANDRE;STOLZE THILO
分类号 H01L23/48;H01L21/60;H01L21/768 主分类号 H01L23/48
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