发明名称 |
Power Semiconductor Module, Method for Producing a Power Semiconductor Module and a Housing Element for a Power Semiconductor Module |
摘要 |
A power semiconductor module includes a housing element into which one or more connecting lugs are inserted. Each connecting lug has a foot region on the topside of which one or more bonding connections can be produced. In order to fix the foot regions, press-on elements are provided, which press against the end of the connecting lug.
|
申请公布号 |
US2012025393(A1) |
申请公布日期 |
2012.02.02 |
申请号 |
US201113192323 |
申请日期 |
2011.07.27 |
申请人 |
KIRSCH OLAF;KANSCHAT PETER;ROEHRIG ANDRE;STOLZE THILO;INFINEON TECHNOLOGIES AG |
发明人 |
KIRSCH OLAF;KANSCHAT PETER;ROEHRIG ANDRE;STOLZE THILO |
分类号 |
H01L23/48;H01L21/60;H01L21/768 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|