MEMS TRANSDUCER DEVICE HAVING STRESS MITIGATION STRUCTURE AND METHOD OF FABRICATING THE SAME

摘要

A micro-electromechanical systems (MEMS) transducer device mounted to a package substrate includes an active transducer having a resonator stack formed over a cavity through a transducer substrate, and a stress mitigation structure between the transducer substrate and the package substrate. The stress mitigation structure reduces stress induced on the transducer substrate due to mismatched coefficients of thermal expansion (CTEs) of the transducer substrate and the package substrate, respectively.