| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for laser dicing and die bonding that can effectively suppress the contamination of the surface of a semiconductor wafer with decomposed matter when the semiconductor wafer is cut with laser light to cut the semiconductor wafer fast with high precision, enables fragmented semiconductor wafers to easily be collected, and facilitates die bonding of the semiconductor chip. SOLUTION: The adhesive sheet for laser die bonding is disclosed which is provided with at least an adhesive layer on a base material, with the etching rate of the adhesive layer as >0.4 [(μm/pulse)/(J/cm<SP>2</SP>)] and the etching rate (etching speed/energy fluence) of the base material as≤0.4 [(μm/pulse)/(J/cm<SP>2</SP>)]. COPYRIGHT: (C)2005,JPO&NCIPI |
