RADIANT HEAT PRINTED CIRCUIT BOARD AND FABICATING METHOD OF THE SAME

摘要

PURPOSE: A heat dissipation printed circuit board and a manufacturing method thereof are provided to enlarge heat dissipation performance by forming the bottom width of a mounting part narrower than the top width of a heat dissipation pad part. CONSTITUTION: A heat dissipation pad part(142) is inserted into a metallic board and an insulating layer. A mounting part(141) is formed in the heat dissipation pad part and mounts an optical device. The bottom width of the mounting part is formed narrower than the top width of the heat dissipation pad part. The cross section of the heat dissipation pad part is one among circular, ellipse or polygon shapes. An optical device mounting pad(145) is composed of copper, aluminum or an alloy of the copper and the aluminum.