发明名称 |
ARAMID FIBER REINFORCED FILM ADHESIVE |
摘要 |
<p>PURPOSE: A film adhesive reinforced with aramid fiber is provided to minimize residual heat stress generated in ultralow temperature conditions, and to remarkably increase crack resistance, by adding an aramid fiber, of which the thermal expansion coefficient. CONSTITUTION: A film adhesive(10) comprises: a resin layer(11), which is semi-hardened by impregnating a thermosetting resin into an aramid fiber(12); and a release film(13) which is temporarily bonded on the surface of the resin layer for protecting the resin layer from contaminants. The aramid fiber is processed in the form of a mat, a knit, a pulp, a staple, or felt, by 3-dimentionally arranging a plurality of aramid fibers. The thermosetting resin is selected from an epoxy resin, a phenol resin, a polyester resin, and a polyurethane resin.</p> |
申请公布号 |
KR20120009129(A) |
申请公布日期 |
2012.02.01 |
申请号 |
KR20100070992 |
申请日期 |
2010.07.22 |
申请人 |
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
LEE, DAI GIL;KIM, BYUNG CHUL;HWANG, YUN JEONG;CHOI, IL BEOM;YOON, SOON HO;KIM, BU GI;KIM, JIN GYU |
分类号 |
C09J7/04;B32B7/04;B32B37/02;C09J7/02 |
主分类号 |
C09J7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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