Printed circuit board and method of manufacturing the same

摘要

A plurality of conductor traces (2) are formed on a porous base insulating layer (1) made of porous ePTFE (expanded polytetrafluoroethylene). Each conductor trace has a laminated structure of a seed layer and a conductor layer. A cover insulating layer (3) is formed on the base insulating layer to cover each conductor trace. The ePTFE used as the porous base insulating layer has continuous pores. An average pore size of the ePTFE is not less than 0.05 µm and not more than 1.0 µm.