发明名称 A METHOD OF FORMING AND USE OF REFRIGERATION CIRCUIT-FORMING MEMBER
摘要 Disclosed is a refrigeration circuit-forming member which has a metal surface and is used for a refrigeration circuit in which HFO-1234yf that is a refrigerant configured of molecules having a double bond is used. The metal surface, which comes into contact with the HFO-1234yf, is covered with a coating layer that is not reactive with the HFO-1234yf within the range of temperature at which the HFO-1234yf is used. The coating layer is formed of any of a coating film that is firmly fixed to the metal surface, a coating layer that is formed by adhesion of a specific component added into the lubricant oil, and a coating layer that is formed by modification of the metal surface layer itself that forms the metal surface. Consequently, the chemical instability that is caused when the refrigerant HFO-1234yf comes into contact with the metal can be eliminated.
申请公布号 EP2413066(A1) 申请公布日期 2012.02.01
申请号 EP20100756004 申请日期 2010.03.19
申请人 SANDEN CORPORATION;GUNMA PREFECTURE 发明人 KOMATSU, SHUNJI;SUZUKI, TAKASHI
分类号 F25B1/00;C09K5/04;C10M147/02;C10M155/02;C10N40/30 主分类号 F25B1/00
代理机构 代理人
主权项
地址